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PRODUCT DOCUMENTATION AND SOFTWARE
Refer to the following documents and software to aid your design process.
Application Notes
? AN1955: Thermal Measurement Methodology of RF Power Amplifiers
? AN3100: General Purpose Amplifier and MMIC Biasing
Software
? .s2p File
For Software, do a Part Number search at http://www.freescale.com, and select the “Part Number” link. Go to the Software &
Tools tab on the part’s Product Summary page to download the respective tool.
REVISION HISTORY
The following table summarizes revisions to this document.
Revision
7
8
9
10
11
Date
Mar. 2007
July 2007
Mar. 2008
Feb. 2012
Dec. 2012
Description
? Corrected and updated Part Numbers in Tables 8, 10 and 11, Component Designations and Values, to
RoHS compliant part numbers, p. 6--8
? Replaced Case Outline 1514--01 with 1514--02, Issue D, p. 1, 12--14. Case updated to add missing
dimension for Pin 1 and Pin 3.
? Removed Footnote 2, Continuous voltage and current applied to device, from Table 2, Maximum Ratings,
p. 1
? Corrected Fig. 13, Single--Carrier W--CDMA Adjacent Channel Power Ratio versus Output Power y--axis
(ACPR) unit of measure to dBc, p. 5
? Corrected S--Parameter table frequency column label to read “MHz” versus “GHz” and corrected
frequency values from GHz to MHz, p. 9, 10
? Corrected temperature at which ThetaJC is measured from 25 ? C to 118 ? C and added “no RF applied” to
Thermal Characteristics table to indicate that thermal characterization is performed under DC test with no
RF signal applied, p. 1
? Table 6, ESD Protection Characterization, removed the word “Minimum” after the ESD class rating. ESD
ratings are characterized during new product development but are not 100% tested during production. ESD
ratings provided in the data sheet are intended to be used as a guideline when handling ESD sensitive
devices, p. 3
? Removed I CC bias callout from applicable graphs and Table 12, Common Emitter S--Parameters heading
as bias is not a controlled value, p. 4--10
? Added .s2p File availability to Product Software, p. 15
? Replaced the PCB Pad Layout drawing, the package isometric and mechanical outline for Case 1514--02
(SOT--89) with Case 2142--01 (SOT--89) as a result of the device transfer from a Freescale wafer fab to an
external GaAs wafer fab and new assembly site. The new assembly and test site’s SOT--89 package has
slight dimensional differences, p. 1, 11--14. Refer to PCN13337, GaAs Fab Transfer .
? Added Fig. 24, Product Marking, p. 11
MMG3002NT1
RF Device Data
Freescale Semiconductor, Inc.
15
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